TODAY’S PATENT – SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Today’s patent was invented by Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, and Kenji Masumoto on December 28, 2004, bearing patent no. US6835595B1 .
The development of compact semiconductor devices has received attention recently. With this progress, the packaging of these semiconductor devices is being miniaturised. The current invention relates to a semiconductor package, such as a wafer level CSP, that requires no wiring board, a semiconductor device, an electronic device, and a method for producing the semiconductor package.
It is more specifically directed toward a semiconductor package, a semiconductor device, and an electronic device that is simple to produce, as well as a method for producing the semiconductor package. The purpose of the current invention is to create a semiconductor package, a semiconductor device that may disperse stress created when the package is installed on a printed circuit board or something similar, and a method for creating the semiconductor package.